Under the core theme of “AI Together”, COMPUTEX 2026 centers on on-device AI computing, physical AI commercialization and full-stack computing infrastructure. OSCOO showcased its full lineup of self-developed storage products at Taipei Nangang Exhibition Center.
DDR5 stands for Double Data Rate 5 Synchronous Dynamic Random-Access Memory. Developed by JEDEC, it is the latest mainstream memory standard for consumer and commercial devices, and the official successor to DDR4.
AI data centers do not use SSDs or HDDs exclusively. They typically deploy both types of drives in a hybrid manner. SSDs, with their excellent performance, handle the core workloads in AI operations that demand high speed, serving as the primary means to unlock computing power.
SK Hynix has proposed a solution to this heat problem called integrated high bandwidth memory, or iHBM. The core of this technology is a special cooling component embedded inside the HBM. This component is named ICE. ICE is made of a silicon‑based material.
Samsung Electronics narrowly avoided what would have been the largest strike in its 56-year history. On the night of May 20, just 90 minutes before an 18-day walkout was scheduled to begin, management and the company’s two main unions reached a tentative wage agreement.
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