DDR5 stands for Double Data Rate 5 Synchronous Dynamic Random-Access Memory. Developed by JEDEC, it is the latest mainstream memory standard for consumer and commercial devices, and the official successor to DDR4.

SK Hynix has proposed a solution to this heat problem called integrated high bandwidth memory, or iHBM. The core of this technology is a special cooling component embedded inside the HBM. This component is named ICE. ICE is made of a silicon‑based material.

Samsung Electronics narrowly avoided what would have been the largest strike in its 56-year history. On the night of May 20, just 90 minutes before an 18-day walkout was scheduled to begin, management and the company’s two main unions reached a tentative wage agreement.

Samsung Electronics is facing the biggest and longest strike in its 56-year history. The National Samsung Electronics Union has announced that a total strike lasting 18 days will begin on May 21, 2026, and continue until June 7.

MTBF stands for “Mean Time Between Failures” and is measured in hours. It is a statistical metric that describes, for a large population of identical SSDs, the average time elapsed between one failure and the next.